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	1.	Thermal stress and strain in microelectronics packaging edited by John H. Lau by Lau, John H Publication details: New York Van Nostrand Reinhold 1993 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.T48. Place hold
	2.	Flip chip technologies / John H. Lau, editor by Lau, John H Series: Electronic packaging and interconnection series Publication details: Boston, Mass. : McGraw-Hill, 1996 Online resources: Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.F584. Place hold
	3.	Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee by Lau, John H Lee, S. W. Ricky Publication details: New York : McGraw-Hill, 2001 Online resources: Table of contents Publisher description Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.L31684 3. Place hold

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