Image from Amazon.com
Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee
Publication details: New York : McGraw-Hill, 2001Description: xxiii, 565 p. : ill. ; 24 cmISBN:- 0071363270
| Item type | Current library | Home library | Collection | Call number | Materials specified | Copy number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|---|---|---|
| AM | PERPUSTAKAAN LINGKUNGAN KEDUA | PERPUSTAKAAN LINGKUNGAN KEDUA KOLEKSI AM-P. LINGKUNGAN KEDUA | - | TK7874.L31684 3 (Browse shelf(Opens below)) | 1 | Available | 00001345915 |
There are no comments on this title.
Log in to your account to post a comment.