Results of search for 'an:60415' › Opac Gemilang catalog

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	1.	Optoelectronic packaging edited by Alan R. Mickelson, Nagesh R. Basavanhally and Yung-Cheng Lee. by Mickelson, Alan R Basavanhally, Nagesh R Lee, Yung-Cheng Publication details: New York John Wiley & Sons 1997 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TA1750 .O59 3. Place hold
	2.	Polymers in microelectronics : furdamentals and applications / David S. Soane and Zoya Martynenko by Soane, David s, 1951- Martynenkoy, Zoya Publication details: Amsterdam : Elsevier North-Holland, 1989 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.S628. Place hold
	3.	Thermal stress and strain in microelectronics packaging edited by John H. Lau by Lau, John H Publication details: New York Van Nostrand Reinhold 1993 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.T48. Place hold
	4.	Fundamentals of microfabrication : the science of miniaturization / Marc J. Madou by Madou, Marc J Edition: 2nd ed. Publication details: Boca Raton : CRC Press, 2002 Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (2)Call number: TK7836.M329 2002, ... Place hold
	5.	MEMS and microsystems : design and manufacture / Tai-Ran Hsu. by Hsu, Tai-Ran Publication details: Boston : McGraw-Hill, 2002 Online resources: Publisher description Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.H784. Place hold
	6.	Flip chip technologies / John H. Lau, editor by Lau, John H Series: Electronic packaging and interconnection series Publication details: Boston, Mass. : McGraw-Hill, 1996 Online resources: Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.F584. Place hold
	7.	No cover image available A study of wire bonded Cu-A1 in microelectronics packaging / Tan Chee Wei by Tan, Chee Wei Publication details: Bangi : Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia, 2002 Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2002 Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TK7874.T36 2002 tesis (00008052077). Place hold
	8.	Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee by Lau, John H Lee, S. W. Ricky Publication details: New York : McGraw-Hill, 2001 Online resources: Table of contents Publisher description Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.L31684 3. Place hold
	9.	No cover image available A study of wire bonded Cu-A1 in microelectronics packaging [microform] / Tan Chee Wei by Tan, Chee Wei Publication details: Bangi : Perpustakaan Tun Seri Lanang, 2004 Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2002 Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: mikrofilem tesis TK7874.T36 2004. Place hold
	10.	Force sensors for microelectronic packaging applications / J. Schwizer, M. Mayer, O. Brand. by Schwizer, Juerg Mayer, M. (Michael Andreas), 1971- Brand, Oliver, 1964- Series: Microtechnology and mems Publication details: Berlin : Springer-Verlag, 2004 Online resources: Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.S34 3. Place hold
	11.	Microelectronic packaging / edited by M. Datta, T. Osaka, J. W. Schultze. by Datta, Madhav Osaka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter) Series: New trends in electrochemical technology ; v. 3 Publication details: Boca Raton, FL : CRC Press, 2005 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.M536 3. Place hold
	12.	Advanced electronic packaging / edited by Richard K. Ulrich, William D. Brown by Ulrich, Richard K Brown, William D, 1943- Series: IEEE Press series on microelectronic systems Edition: 2nd ed. Publication details: Piscataway, N.J. : IEEE Press, 2006 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.A389 2006 3. Place hold
	13.	No cover image available Failure-free integrated circuit packages : systematic elimination of failures through reliability engineering, failure analysis, and material improvements / Charles Cohn, Charles A. Harper, [editors] by Cohn, Charles Harper, Charles A Series: McGraw-Hill professional engineering Publication details: New York : McGraw-Hill, 2005 Online resources: Contributor biographical information Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.F356 3. Place hold
	14.	MEMS/MOEMS packaging : concepts, designs, materials, and processes / Ken Gilleo by Gilleo, Ken Series: McGraw-Hill nanoscience and technology series Publication details: New York : McGraw-Hill, 2005 Online resources: Table of contents only Contributor biographical information Publisher description Table of contents only Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.G558 3. Place hold
	15.	Force Sensors for Microelectronic Packaging Applications [electronic resource] / by Jurg Schwizer, Michael Mayer, Oliver Brand. by Schwizer, Jurg Mayer, Michael Brand, Oliver SpringerLink (Online service) Series: Microtechnology and MEMS Publication details: Berlin, Heidelberg : Springer-Verlag Berlin Heidelberg, 2005 In: Springer e-books Online resources: Click here to access online Availability: No items available.
	16.	Hot Cracking Phenomena in Welds [electronic resource] / edited by Thomas Bollinghaus, Horst Herold. by Bollinghaus, Thomas Herold, Horst SpringerLink (Online service) Publication details: Berlin, Heidelberg : Springer-Verlag Berlin Heidelberg, 2005 In: Springer e-books Online resources: Click here to access online Availability: No items available.
	17.	Physical Design Essentials [electronic resource] : An ASIC Design Implementation Perspective / by Khosrow Golshan. by Golshan, Khosrow SpringerLink (Online service) Publication details: Boston, MA : Springer Science+Business Media, LLC, 2007 In: Springer e-books Online resources: Click here to access online Availability: No items available.
	18.	No cover image available Sputtered silicon encapsulation : wafer level packaging for MEMs devices / Azrul Azlan Bin Hamzah by Azrul Azlan Hamzah Publication details: Bangi : Institut Kejuruteraan Mikro dan Nanoelektronik, Universiti Kebangsaan Malaysia, 2008 Dissertation note: Thesis (Ph.D) - Universiti Kebangsaan Malaysia, 2008 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.A9978 2008 3tesis. Place hold
	19.	Mems and microsystems : design, manufacture, and packaging / Tai-Ran Hsu by Hsu, Tai-Ran Edition: 2nd ed. Publication details: Hoboken, N. J. : John Wiley & Sons, 2008 Online resources: Table of contents only Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.H784 2008 3. Place hold
	20.	Microelectronic packaging [electronic resource] / edited by M. Datta, T. Osaka, J. W. Schultze by Datta, Madhav saka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter) Series: New trends in electrochemical technology ; v. 3 Publication details: Boca Raton, FL : CRC Press, c2005 Online resources: Click here to access online CRCnetBASE Click here for the electronic version Availability: No items available.

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