Lead-free solder joint improvement in ball grid array semiconductor packages / (Record no. 617897)

MARC details
000 -LEADER
fixed length control field 01320nam a2200361 i 4500
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20250930141816.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 170315s2015 my a m 000 0 eng d
039 #9 - LEVEL OF BIBLIOGRAPHIC CONTROL AND CODING DETAIL [OBSOLETE]
Level of rules in bibliographic description 201706011007
Level of effort used to assign nonsubject heading access points hendon
y 03-15-2017
z hamdan
040 ## - CATALOGING SOURCE
Original cataloging agency UKM
Description conventions rda
090 ## - LOCALLY ASSIGNED LC-TYPE CALL NUMBER (OCLC); LOCAL CALL NUMBER (RLIN)
Classification number (OCLC) (R) ; Classification number, CALL (RLIN) (NR) TK7870.16.E945 2015 3 tesis
090 ## - LOCALLY ASSIGNED LC-TYPE CALL NUMBER (OCLC); LOCAL CALL NUMBER (RLIN)
Classification number (OCLC) (R) ; Classification number, CALL (RLIN) (NR) TK7870.16
Local cutter number (OCLC) ; Book number/undivided call number, CALL (RLIN) .E945 2015 3
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Eu, Poh Leng,
Relator term author.
245 10 - TITLE STATEMENT
Title Lead-free solder joint improvement in ball grid array semiconductor packages /
Statement of responsibility, etc. Eu Poh Leng.
264 #0 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Date of production, publication, distribution, manufacture, or copyright notice 2015.
300 ## - PHYSICAL DESCRIPTION
Extent xxvi, 211 pages :
Other physical details illustrations ;
Dimensions 30 cm.
336 ## - CONTENT TYPE
Content type term text
Source rdacontent
337 ## - MEDIA TYPE
Media type term unmediated
Source rdamedia
338 ## - CARRIER TYPE
Carrier type term volume
Source rdacarrier
502 ## - DISSERTATION NOTE
Dissertation note Thesis (Ph.D) - Universiti Kebangsaan Malaysia, 2015.
504 ## - BIBLIOGRAPHY, ETC. NOTE
Bibliography, etc. note References : pages 191-201.
610 20 - SUBJECT ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element Universiti Kebangsaan Malaysia
General subdivision Dissertations.
9 (RLIN) 62865
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Solder and soldering.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Lead-free electronics manufacturing processes.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Dissertations, Academic
Geographic subdivision Malaysia.
9 (RLIN) 62866
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Ball grid array technology.
9 (RLIN) 65334
907 ## - LOCAL DATA ELEMENT G, LDG (RLIN)
a .b16447098
b 2025-07-18
c 2019-11-12
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type TERHAD
Suppress in OPAC No
Call number prefix TK7870.16.E945 2015 3 tesis
914 ## - VTLS Number
VTLS Number vtls003619168
990 ## - EQUIVALENCES OR CROSS-REFERENCES [LOCAL, CANADA]
Link information for 9XX fields hak/ha
991 ## - LOCAL NOTE (NAMA FAKULTI/INSTITUT/PUSAT)
a Fakulti Kejuruteraan dan Alam Bina
998 ## - LOCAL CONTROL INFORMATION (RLIN)
Library PERPUSTAKAAN LINGKUNGAN KEDUA
Operator's initials, OID (RLIN) 2017-02-03
Cataloger's initials, CIN (RLIN) m
Material Type (Sierra) Thesis
Language English
Country
-- 0
-- .b16447098
Holdings
Withdrawn status Lost status Damaged status Not for loan Collection Home library Current library Shelving location Date acquired Source of acquisition Cost, normal purchase price Inventory number Total checkouts Full call number Barcode Date last seen Copy number Price effective from Koha item type
          PERPUSTAKAAN LINGKUNGAN KEDUA PERPUSTAKAAN LINGKUNGAN KEDUA TESIS-P. LINGKUNGAN KEDUA 12/11/2019 - 0.00 .i21012945   TK7870.16.E945 2015 3 tesis 00002205057 18/09/2025 1 18/09/2025 TERHAD

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