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Lead-free solder joint improvement in ball grid array semiconductor packages /

Eu, Poh Leng,

Lead-free solder joint improvement in ball grid array semiconductor packages / Eu Poh Leng. - xxvi, 211 pages : illustrations ; 30 cm.

Thesis (Ph.D) - Universiti Kebangsaan Malaysia, 2015.

References : pages 191-201.

Subjects--Corporate Names:
Universiti Kebangsaan Malaysia--Dissertations.

Subjects--Topical Terms:
Solder and soldering.
Lead-free electronics manufacturing processes.
Dissertations, Academic--Malaysia.
Ball grid array technology.

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Lead-free solder joint improvement in ball grid array semiconductor packages /

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