| 000 | 01320nam a2200361 i 4500 | ||
|---|---|---|---|
| 005 | 20250930141816.0 | ||
| 008 | 170315s2015 my a m 000 0 eng d | ||
| 039 | 9 |
_a201706011007 _bhendon _y03-15-2017 _zhamdan |
|
| 040 |
_aUKM _erda |
||
| 090 | _aTK7870.16.E945 2015 3 tesis | ||
| 090 |
_aTK7870.16 _b.E945 2015 3 |
||
| 100 | 1 |
_aEu, Poh Leng, _eauthor. |
|
| 245 | 1 | 0 |
_aLead-free solder joint improvement in ball grid array semiconductor packages / _cEu Poh Leng. |
| 264 | 0 | _c2015. | |
| 300 |
_axxvi, 211 pages : _billustrations ; _c30 cm. |
||
| 336 |
_atext _2rdacontent |
||
| 337 |
_aunmediated _2rdamedia |
||
| 338 |
_avolume _2rdacarrier |
||
| 502 | _aThesis (Ph.D) - Universiti Kebangsaan Malaysia, 2015. | ||
| 504 | _aReferences : pages 191-201. | ||
| 610 | 2 | 0 |
_aUniversiti Kebangsaan Malaysia _xDissertations. _962865 |
| 650 | 0 | _aSolder and soldering. | |
| 650 | 0 | _aLead-free electronics manufacturing processes. | |
| 650 | 0 |
_aDissertations, Academic _zMalaysia. _962866 |
|
| 650 | 0 |
_aBall grid array technology. _965334 |
|
| 907 |
_a.b16447098 _b2025-07-18 _c2019-11-12 |
||
| 942 |
_c3 _n0 _kTK7870.16.E945 2015 3 tesis |
||
| 914 | _avtls003619168 | ||
| 990 | _ahak/ha | ||
| 991 | _aFakulti Kejuruteraan dan Alam Bina | ||
| 998 |
_al _b2017-02-03 _cm _dx _feng _gmy _y0 _z.b16447098 |
||
| 999 |
_c617897 _d617897 |
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