| 000 | 01381nam a2200361 i 4500 | ||
|---|---|---|---|
| 005 | 20250930135538.0 | ||
| 008 | 140515t2012 my a g bm 000 0 eng d | ||
| 039 | 9 |
_a201407211208 _blan _c201406301553 _dhendon _c201405150919 _dmiza _y05-15-2014 _zmiza |
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| 040 |
_aUKM _erda |
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| 090 | _aTK7870.16.W643 2012 3 tesis | ||
| 090 |
_aTK7870.16 _b.W643 2012 3 |
||
| 100 | 1 |
_aWong, Tszu Ling, _eauthor. |
|
| 245 | 1 | 3 |
_aAn investigation on mechanical properties of tin-silver copper and tin-silver lead-free solder sphere used in FCPBGA electronic packages / _cWong Tzu Ling. |
| 264 | 0 | _c2012. | |
| 300 |
_axiv, 85 pages : _bsome colour illustrations ; _c30 cm. |
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| 336 |
_atext _2rdacontent |
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| 337 |
_aunmediated _2rdamedia |
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| 338 |
_avolume _2rdacarrier |
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| 502 | _aThesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2012. | ||
| 504 | _aReferences : pages [76]-79. | ||
| 610 | 2 | 0 |
_aUniversiti Kebangsaan Malaysia _xDissertations. _962865 |
| 650 | 0 |
_aDissertations, Academic _zMalaysia. _962866 |
|
| 650 | 0 | _aFlip chip technology. | |
| 650 | 0 | _aCopper. | |
| 650 | 0 | _aElectronic packaging. | |
| 907 |
_a.b15900605 _b2025-07-18 _c2019-11-12 |
||
| 942 |
_c3 _n0 _kTK7870.16.W643 2012 3 tesis |
||
| 914 | _avtls003559382 | ||
| 990 | _armn/ha | ||
| 991 | _aFakulti Kejuruteraan dan Alam Bina | ||
| 998 |
_al _b2014-02-05 _cm _dx _feng _gmy _y0 _z.b15900605 |
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| 999 |
_c569671 _d569671 |
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