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_a201406271037 _bathirah _c201406270935 _dathirah _y04-15-2014 _zmiza |
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| 040 |
_aUKM _erda |
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| 090 | _aTK7870.15.M844 2011 3 tesis | ||
| 090 |
_aTK7870.15 _b.M844 2011 3 |
||
| 100 | 0 |
_aMohd Faridz bin Mod Yunoh @ Mohd Yunus, _eauthor. |
|
| 245 | 1 | 0 |
_aPencirian kebolehtahanan pakej semikonduktor dai bertingkat tanpa kaki / _cMohd Faridz bin Mod Yunoh @ Mohd Yunus. |
| 264 | 0 | _c2011. | |
| 300 |
_axvi, 118 pages : _billustrations ; _c30 cm. |
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| 336 |
_atext _2rdacontent |
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| 337 |
_aunmediated _2rdamedia |
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| 338 |
_avolume _2rdacarrier |
||
| 502 | _aTesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2011. | ||
| 504 | _aRujukan : page [108]-116. | ||
| 610 | 2 | 0 |
_aUniversiti Kebangsaan Malaysia _xDissertations. _962865 |
| 650 | 0 | _aElectronic packaging. | |
| 650 | 0 | _aSemiconductors. | |
| 650 | 0 |
_aDissertations, Academic _zMalaysia. _962866 |
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| 907 |
_a.b15879197 _b2025-07-18 _c2019-11-12 |
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_c3 _n0 _kTK7870.15.M844 2011 3 tesis |
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| 914 | _avtls003557008 | ||
| 990 | _armn/athirah | ||
| 991 | _aFakulti Kejuruteraan dan Alam Bina | ||
| 998 |
_al _b2014-02-04 _cm _dx _fmay _gmy _y0 _z.b15879197 |
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