| 000 | 00926nam a2200265 a 4500 | ||
|---|---|---|---|
| 005 | 20250914075928.0 | ||
| 008 | 981208s1992 xxu 00 eng | ||
| 020 | _a0442013531 | ||
| 039 | 9 |
_y08-18-1999 _zload |
|
| 090 |
_aTK7868.P7 _bH826 3 |
||
| 100 | 1 | _aHwang, Jennie S. | |
| 245 | 1 | 0 |
_aSolder paste in electronics packaging : _btechnology and applications in surface mount, hybrid circuits, and component assembly / _cJennie S. Hwang |
| 260 |
_aNew York : _bVan Nostrand Reinhold, _c1992 |
||
| 300 |
_a456 p. : _bill. ; _c23 cm. |
||
| 600 | 1 | _aSurface mount technology | |
| 650 | 0 |
_aPrinted circuits _xDesign and construction |
|
| 650 | 0 | _aSolder pastes | |
| 907 |
_a.b12164331 _b2023-01-17 _c2019-11-12 |
||
| 942 |
_c01 _n0 _kTK7868.P7 H826 3 |
||
| 914 | _avtls000223438 | ||
| 991 | _aFakulti Kejuruteraan | ||
| 998 |
_al _b1999-05-08 _cm _da _feng _gxxu _y0 _z.b12164331 |
||
| 999 |
_c217886 _d217886 |
||