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1.
Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harmon. by Series: Electronic packaging and interconnection series
Edition: 2nd ed.
Publication details: New York : McGraw-Hill, 1997
Online resources:
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7836.H373 1997.

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Force sensors for microelectronic packaging applications / J. Schwizer, M. Mayer, O. Brand. by Series: Microtechnology and mems
Publication details: Berlin : Springer-Verlag, 2004
Online resources:
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.S34 3.

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4.
Hot Cracking Phenomena in Welds [electronic resource] / edited by Thomas Bollinghaus, Horst Herold. by
Publication details: Berlin, Heidelberg : Springer-Verlag Berlin Heidelberg, 2005
In: Springer e-books
Online resources:
Availability: No items available.

5.
Wire bonding in microelectronics / George G. Harmon by
Edition: 3rd ed.
Publication details: New York : McGraw-Hill, 2010
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (2)Call number: TK7836.H373 2010 3, ...

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Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN / Mohamad Firdaus bin Rosle by
Publication details: 2010
Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2010
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TK7874.M844 2010 tesis (00008052076).

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7.
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Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN [microform] / Mohamad Firdaus bin Rosle by
Publication details: Universiti Kebangsaan Malaysia, Bangi : 2012
Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2010
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: mikrofilem tesis TK7874 .M844 2012.

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Pencirian morfologi permukaan kapilari bagi hasil keluaran lekatan wayar pakej ultra fine pitch large quad flat / Nurul Hidayah Mohamad Nor. by
Publication details: 2011
Dissertation note: Thesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2011.
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.N847 2011 3tesis.

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9.
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Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) / Saidatul Azura binti Radzi. by
Publication details: 2011
Dissertation note: Tesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2011.
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TK7836.S235 2011 [00008051987].

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10.
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Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) [microform] / Saidatul Azura binti Radzi. by
Publication details: Bangi: Perpustakaan Tun Seri Lanang, 2013
Dissertation note: Tesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2011.
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: Mikrofis tesis TK7836 \b .S235 2013.

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Pencirian sambungan pelekatan wayar dengan menggunakan kaedah pelekukan nano / Muhammad Nubli bin Zulkifli. by Producer: 2014
Dissertation note: Tesis (P.hD.) - Universiti Kebangsaan Malaysia, 2014.
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7836.M846 2014 3 tesis.

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