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1.
The Basics of soldering / Armin Rahn by
Publication details: New York : John Wiley & Sons, 1993
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.R34 3.

2.
Capillary joining : brazing and soft-soldering / C.J. Thwaites by Series: Materials science research studies series
Publication details: Chichester : Research Studies Press, 1982
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TT267.T58.

3.
Development of highly reliable soldered joints for printed circuits boards : final report by
Publication details: Baltimore Maryland : Westinghouse Defense and Space Center, 1968
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (2)Call number: TT267.D478 n.2, ...

4.
Development of improved solders for electronic reliability : technical report AFML-TR-77-93 final report for period 15 March 1976 to 12 April 1977
Publication details: Springfiled, Va. : National Technical Information Service, 1977
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TT267.D48.

5.
Handbook of machine soldering : a guide for the soldering of electronic printed wiring assemblies Ralph W. Woodgate. by
Publication details: New York : b Wiley, 1983
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (3)Call number: TT267.W66, ...

6.
Metals joining manual / M. M. Schwartz by
Publication details: New York : McGraw-Hill, 1979
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TS227.2.S38.

7.
The significance of strength for the reliability of solder joints in electronics R. Gohle by Series: Technical translation. ESRO TT ; .58
Publication details: S.l. European Space Research Organisation 1974
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TT267.G63.

8.
Soldering / C. J. Thwaites and B. T. K. Barry by Series: Engineering design guides ; 07
Publication details: Oxford : Oxford University Press, 1975
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TT267.T59.

9.
Soldering and surface mount technology
Publication details: Dublin, Scotland : WELA Publications, 1989
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (5)Call number: Siri TT267.S62 1991-1992, ...

10.
Soldering for electronic assemblies / Leo P. Lambert by Series: Manufacturing engineering and materials processing ; 25
Publication details: New York : Marcel Dekker, 1988
Availability: Not available: PERPUSTAKAAN TUN SERI LANANG: Discard (1).

11.
Soldering in electronics / by R. J. Klein Wassink. by
Publication details: Ayr 8, Barns St., Ayr, KA7 1XA : Electrochemical Publications, 1984
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (2)Call number: TS226.K5 3, ... PERPUSTAKAAN TUN SERI LANANG (1)Call number: TS226.K5.

12.
Soldering manual / prepared by AWS Committee on Brazing and Soldering under the direction of AWS Technical Acativities Committee by
Edition: 2nd. ed. revised
Publication details: Miami : American Welding Society, 1978
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TT267.A55 1978. Not available: PERPUSTAKAAN TUN SERI LANANG: Discard (1).

13.
Solders and soldering : materials, design, production, and analysis for reliable bonding / Howard H. Manko by
Edition: 2nd ed.
Publication details: New York : McGraw-Hill, 1979
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TT267.M26 1979.

14.
Stress relief techniques for reducing, thermal fatigue in solder joints / (prepared by) prject leader, D.M.Jarboe project team: A.G.Bennett ... (et.al.) by
Publication details: Kansas City : Bendix, 1978
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TA418.58.J37.

15.
Surface mount technology with fine pitch components : the manufacturing issues / Hans Danielsson by
Publication details: London : Chapman & Hall, 1995
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.D35 3.

16.
Specification for resin flux cored solder / Standards & Industrial Research Institute of Malaysia. by Series: Malaysian standard ; MS 964 : 1985Publisher: Shah Alam, Selangor : Standards and Industrial Research Institute of Malaysia, 1985
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: MK10 SIRIM 17 MS 964 : 1985.

17.
Specification for soft solder / Standards & Industrial Research Institute of Malaysia. by Series: Malaysian standard ; MS 870 : 1984
Publication details: Shah Alam : Standards & Industrial Research Institute of Malaysia, 1984
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: MK10 SIRIM 17 MS 870 : 1984.

18.
Methods of test for resin flux cored solder / Standards and Industrial Research Institute of Malaysia. by Series: Malaysian standard ; MS 1006 : 1986Publisher: Shah Alam, Selangor : Standards and Industrial Research Institute of Malaysia, 1986
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (2)Call number: MK10 SIRIM 17 MS 1006 : 1986, ...

19.
Quality hand soldering & circuit board repair / H. Smith by
Edition: 3rd ed.
Publication details: Albany, New York : Delmar, 2001
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7868.P7S56 1997 3.

20.
Modern electronics soldering techniques / by Andrew Singmin by
Publication details: Indianapolis, IN : Prompt Publications, 2000
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7873.S56 3.

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