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1.
Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices / by Mohd Salleh Ismail. by
Publication details: Davis, Calif: University of California, 1993
Dissertation note: Thesis (Doctor of Philosophy) - University of California, 1993.
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TK7871.85.M84 4.

2.
Semiconductor industry : wafer fab exhaust management / J. Michael Sherer by
Publication details: Boca Raton : CRC/Taylor & Francis, 2005
Other title:
  • Wafer fab exhaust management
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7871.85.S46 3.

3.
Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices [microform] / by Mohd Salleh Ismail by
Publication details: Davis, Calif. Perpustakaan Tun Seri Lanang, 2006
Dissertation note: Thesis (Doctor of Philosophy) - University of California, 1993
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: mikrofilem tesis TK7871.85.M84 2006.

4.
Kesan penipisan wafer terhadap keutuhan mekanikal wafer silikon dan proses pemotongan / Hoh Huey Jiun by
Publication details: Bangi : Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia, 2006
Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2006
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7871.85.H648 2006 tesis 3.

5.
Keboleharapan pakej skala wafer (WSP) menggunakan teknologi pengendapan nikel tanpa elektrik rendaman emas (ENIG) metalurgi bonggol bawahan (UBM) / Siti Hajar Abdullah by
Publication details: Bangi : Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia, 2007
Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2007
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7871.85.S58 2007 tesis 3.

6.
Kesan penipisan wafer terhadap keutuhan mekanikal wafer silikon dan proses pemotongan [microform] / Hoh Huey Jiun by
Publication details: Bangi : Perpustakaan Tun Seri Lanang, 2009
Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2006
Availability: No items available.

7.
Kesan penipisan wafer terhadap keutuhan mekanikal wafer silikon dan proses pemotongan / Hoh Huey Jiun by Publisher: Bangi : Perpustakaan Tun Seri Lanang, 2009
Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2006
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: mikrofis tesis TK7871.85 H468 2009.

8.
9.
Semiconductor industry [electronic resource] : wafer fab exhaust management / J. Michael Sherer by
Publication details: Boca Raton : CRC/Taylor & Francis, 2005
Other title:
  • Wafer fab exhaust management
Availability: No items available.

10.
Keboleharapan pakej skala wafer (WSP) menggunakan teknologi pengendapan nikel tanpa elektrik rendaman emas (ENIG) metalurgi bonggol bawahan (UBM) [microform]/ Siti Hajar Abdullah by
Publication details: Bangi, Selangor : Perpustakaan Tun Seri Lanang, Universiti Kebangsaan Malaysia 2010
Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2007
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: mikrofis tesis TK7871.85.S58 2010.

11.
Sapphire : structure, technology, and applications / Isaias Tartaglia, editor. by Series: Materials science and technologies
Publication details: New York : Novinka, [2013]
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TK7871.85.S267.

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