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	1.	Lead-free electronics / edited by Michael Pecht, Sanka Ganesan by Pecht, Michael Ganesan, Sanka Publication details: Hoboken, N.J. : Wiley, 2006 Online resources: Publisher description Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.L43 3. Place hold
	2.	A Guide to Lead-free Solders [electronic resource] : Physical Metallurgy and Reliability / by John W. Evans ;edited by Werner Engelmaier. by Evans, John W Engelmaier, Werner SpringerLink (Online service) Publication details: London : Springer-Verlag London Limited, 2007 In: Springer e-books Online resources: Click here to access online Availability: No items available.
	3.	No cover image available Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) / Ibrahim Bin Ahmad by Ibrahim Ahmad Publication details: Bangi : Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia, 2007 Dissertation note: Tesis (Ph.D.) - Universiti Kebangsaan Malaysia, 2007 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7836.I277 2007 tesis 3. Place hold
	4.	No cover image available Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor / Muhammad Najib bin Harif by Muhammad Najib Harif Publication details: 2008 Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2008 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TS610.M836 2008 tesis 3. Place hold
	5.	No cover image available Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor /h [microform]/ Muhammad Najib bin Harif by Muhammad Najib Harif Publication details: Bangi, Perpustakaan Tun Seri Lanang, 2008 Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2008 Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: mikrofis tesis TS610.M836 2010. Place hold
	6.	Global life cycle impact assessments of material shifts [electronic resource] : the example of a lead-free electronics industry / by A.S.G. Andrae. by Andrae, A.S.G SpringerLink (Online service) Publication details: London : Springer-Verlag London, 2010 In: Springer eBooks Online resources: Click here to access online Availability: No items available.
	7.	Lead-free solder process development / Jasbir Bath, Greg Henshall, Carol Handwerker. by Bath, Jasbir Henshall, Gregory Arthur Handwerker, Carol A Publication details: Hoboken, N.J. : Wiley, 2010 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7836.B383 pasca. Place hold
	8.	No cover image available Evolusi mikrostruktur aloi pateri bebas plumbum akibat tindakan terma dan elektrik / Norainiza bt Saud. by Norainiza Saud Publication details: 2011 Dissertation note: Tesis (Ph.D.) - Universiti Kebangsaan Malaysia, 2011. Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TS610.N646 2011 tesis. Place hold
	9.	No cover image available Pencirian bahan sebatian antara logam di dalam sistem aloi pateri bebas-plumbum timah-perak-antimoni / Wedianti binti Shualdi. by Wedianti Shualdi [author.] Producer: 2013 Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2013. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TS610.W434 2013 3 tesis. Place hold
	10.	No cover image available Lead-free solder joint improvement in ball grid array semiconductor packages / Eu Poh Leng. by Eu, Poh Leng [author.] Producer: 2015 Dissertation note: Thesis (Ph.D) - Universiti Kebangsaan Malaysia, 2015. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.16.E945 2015 3 tesis. Place hold

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