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	1.	No cover image available Penyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) / Zainudin bin Kornain. by Zainudin Kornain Publication details: 2012 Dissertation note: Tesis (Ph.D.) - Universiti Kebangsaan Malaysia, 2012. Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TK7870.16.Z337 2012 [00008051985]. Place hold
	2.	No cover image available An investigation on mechanical properties of tin-silver copper and tin-silver lead-free solder sphere used in FCPBGA electronic packages / Wong Tzu Ling. by Wong, Tszu Ling [author.] Producer: 2012 Dissertation note: Thesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2012. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.16.W643 2012 3 tesis. Place hold

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