Your search returned 7 results.

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	1.	Multichip module design, fabrication and testing James J. Licari. by Licari, James J., 1930- Series: Electronic packaging and interconnection series Publication details: New York McGraw-Hill 1995 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.L53. Place hold
	2.	Plastics for electronics : materials, properties, and design applications / William M. Alvino. by Alvino, William M [author.] Series: Electronic packaging and interconnection series Publication details: New York : McGraw-Hill, 1995 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7871.15.P5A48. Place hold
	3.	Electronic connector handbook : theory and applications / Robert S. Mroczkowski. by Mroczkowski, Robert S Series: Electronic packaging and interconnection series Publication details: New York : McGraw-Hill, 1998 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK3521.M76. Place hold
	4.	Thermal management handbook : for electronic assemblies / Jerry Sergent, Al Krum. by Sergent, Jerry E Krum, Al Series: Electronic packaging and interconnection series Publication details: New York : McGraw-Hill, 1998 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.25.S47. Place hold
	5.	Electronic systems quality management handbook / Marsha Ludwig-Becker, editor by Ludwig-Becker, Marsha Series: Electronic packaging and interconnection series Publication details: New York : McGraw-Hill, 1998 Other title: Electronics quality management handbook Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7836.E4656. Place hold
	6.	Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harmon. by Harman, George G Harman, George G. Reliability and yield problems of wire bonding in microelectronics Series: Electronic packaging and interconnection series Edition: 2nd ed. Publication details: New York : McGraw-Hill, 1997 Online resources: Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7836.H373 1997. Place hold
	7.	Flip chip technologies / John H. Lau, editor by Lau, John H Series: Electronic packaging and interconnection series Publication details: Boston, Mass. : McGraw-Hill, 1996 Online resources: Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.F584. Place hold

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