Your search returned 14 results.

Sort
Unhighlight Highlight
Select all Clear all
Select titles to:
Results
1.
Food packaging : principles and practice / Gordon L. Robertson. by Series: Packaging and converting technology ; vol.6.
Publication details: New York : Marcel Dekker, 1993
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TP374.R63 3. PERPUSTAKAAN TUN SERI LANANG (1)Call number: TP374.R63.

Place hold
2.
An International survey of package design = ein internationales handbuch der packunges-talfung un repertoire international des formes de l'emallage / edited by Walter Herdeg. by Series: Packaging ; v.4.
Publication details: Zurich, Switzerland : Graphis, 1984
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TS195.I57.

Place hold
3.
Multichip module design, fabrication and testing James J. Licari. by Series: Electronic packaging and interconnection series
Publication details: New York McGraw-Hill 1995
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.L53.

Place hold
4.
Plastics for electronics : materials, properties, and design applications / William M. Alvino. by Series: Electronic packaging and interconnection series
Publication details: New York : McGraw-Hill, 1995
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7871.15.P5A48.

Place hold
5.
Plastics in food packaging : properties, design and fabrication / with contributions by Charles R. Finch, Alan Speigel, Jerome H. Heckman. by Series: Packaging and converting technology ; 5
Publication details: New York : Marcel Dekker, 1992
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TP374.B76.

Place hold
6.
Electronic connector handbook : theory and applications / Robert S. Mroczkowski. by Series: Electronic packaging and interconnection series
Publication details: New York : McGraw-Hill, 1998
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK3521.M76.

Place hold
7.
Thermal management handbook : for electronic assemblies / Jerry Sergent, Al Krum. by Series: Electronic packaging and interconnection series
Publication details: New York : McGraw-Hill, 1998
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.25.S47.

Place hold
8.
Electronic systems quality management handbook / Marsha Ludwig-Becker, editor by Series: Electronic packaging and interconnection series
Publication details: New York : McGraw-Hill, 1998
Other title:
  • Electronics quality management handbook
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7836.E4656.

Place hold
9.
Electronic packaging materials and their properties / Michael G. Pecht ... [et al.] by Series: The electronic packaging series
Publication details: Boca Raton : CRC Press, 1999
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.E433 3.

Place hold
10.
Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harmon. by Series: Electronic packaging and interconnection series
Edition: 2nd ed.
Publication details: New York : McGraw-Hill, 1997
Online resources:
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7836.H373 1997.

Place hold
11.
Flip chip technologies / John H. Lau, editor by Series: Electronic packaging and interconnection series
Publication details: Boston, Mass. : McGraw-Hill, 1996
Online resources:
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.F584.

Place hold
12.
Food packaging technology / edited by Richard Coles, Derek McDowell and Mark J. Kirwan by Series: Packaging technology series
Publication details: Oxford : Blackwell Publishing, 2003
Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TP374.F62.

Place hold
13.
Integrated packaging systems for transportation and distribution / Charles W. Ebeling. by Series: Packaging and converting technology ; 3
Publication details: New York : M. Dekker, 1990
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TS195.2.E26 1990 3[00060066350].

Place hold
14.
Design and modeling for 3D ICs and interposers / by Madhavan Swaminathan, Ki Jin Han. by Series: WSPC series in advanced integration and packaging ; 2Publisher: Hackensack, NJ : World Scientific, [2014]Copyright date: ©2014
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.893.S836 3.

Place hold
Pages

Contact Us

Perpustakaan Tun Seri Lanang, Universiti Kebangsaan Malaysia
43600 Bangi, Selangor Darul Ehsan,Malaysia
+603-89213446 – Consultation Services
019-2045652 – Telegram/Whatsapp
Email: helpdeskptsl@ukm.edu.my

Copyright ©The National University of Malaysia Library