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1.
Fundamentals of microsystems packaging / Rao R. Tummala, editor by
Publication details: New York : McGraw-Hill, 2001
Online resources:
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.F863 3.

2.
Microelectronics packaging handbook / edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein by
Edition: 2nd ed.
Publication details: New York : Chapman & Hall, 1997
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (2)Call number: TK7874.M483 1997 3, ...

3.
Introduction to system-on-package (SOP) : miniaturization of the entire system / Rao R. Tummala, Madhavan Swaminathan by
Publication details: New York : McGraw-Hill, 2008
Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.T864 3.

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