An investigation on mechanical properties of tin-silver copper and tin-silver lead-free solder sphere used in FCPBGA electronic packages / Wong Tzu Ling.
Producer: 2012Description: xiv, 85 pages : some colour illustrations ; 30 cmContent type:- text
- unmediated
- volume
| Item type | Current library | Home library | Collection | Call number | Materials specified | Copy number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|---|---|---|
| TERHAD | PERPUSTAKAAN LINGKUNGAN KEDUA | PERPUSTAKAAN LINGKUNGAN KEDUA TESIS-P. LINGKUNGAN KEDUA | - | TK7870.16.W643 2012 3 tesis (Browse shelf(Opens below)) | 1 | Available | 00002111572 |
Thesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2012.
References : pages [76]-79.
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