Strenght and mould proofing of a soy-based adhesive [article] / Weihong Wang, Qingwen Wang
In: Advances and challenges in biocomposites : proceedings of the 8th Pacific RIM Bio-Based Composites Symposium, Kuala Lumpur, 20-23 November 2006 [article]No physical items for this record
PTSL Koleksi Asia Tenggara (Pages 150 - 155), (Call Number : HD9766.M32.P378 2006)
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