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Solder joint reliability prediction for multiple environments [electronic resource] / by Andrew E. Perkins, Suresh K. Sitaraman.

By: Contributor(s): Publication details: Boston, MA : Springer Science+Business Media, LLC, 2009.Description: xv, 192 pages : illustrations, digitalISBN:
  • 9780387793948
Subject(s): Online resources: In: Springer eBooks
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