Microelectronics packaging handbook / edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Publication details: New York : Chapman & Hall, 1997Edition: 2nd edDescription: 3 v. : ill. ; 24 cmISBN:- 0412084317 (pt. 1)
- 0412084414 (pt. 2)
- 0412084511 (pt. 3)
Contents:
pt. 1. Technology drivers -- pt. 3. Subsystem packaging
| Item type | Current library | Home library | Collection | Call number | Materials specified | Copy number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|---|---|---|
| AM | PERPUSTAKAAN LINGKUNGAN KEDUA | PERPUSTAKAAN LINGKUNGAN KEDUA KOLEKSI AM-P. LINGKUNGAN KEDUA | - | TK7874.M483 1997 3 (Browse shelf(Opens below)) | bhg. 1 | 1 | Available | 00001478492 | ||
| AM | PERPUSTAKAAN LINGKUNGAN KEDUA | PERPUSTAKAAN LINGKUNGAN KEDUA KOLEKSI AM-P. LINGKUNGAN KEDUA | - | TK7874.M483 1997 3 (Browse shelf(Opens below)) | bhg. 3 | 1 | Available | 00001478491 |
Includes bibliographical references and index
pt. 1. Technology drivers -- pt. 3. Subsystem packaging
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