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Polymeric materials for electronics packaging and interconnection / John H. Lupinski, editor, Robert S. Moore, editor
Series: ACS symposium series ; 407Publication details: Washington, DC : American Chemical Society, 1989Description: xi, 499 p. : ill. ; 24 cmISBN:- 0841216797
| Item type | Current library | Home library | Collection | Call number | Materials specified | Copy number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|---|---|---|
| AM | PERPUSTAKAAN LINGKUNGAN KEDUA | PERPUSTAKAAN LINGKUNGAN KEDUA KOLEKSI AM-P. LINGKUNGAN KEDUA | - | TK7870.P648 (Browse shelf(Opens below)) | 1 | Available | 00001303854 |
'Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988.'
Includes bibliographical references
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