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	1.	No cover image available Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices / by Mohd Salleh Ismail. by Mohd. Salleh Ismail Publication details: Davis, Calif: University of California, 1993 Dissertation note: Thesis (Doctor of Philosophy) - University of California, 1993. Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TK7871.85.M84 4. Place hold
	2.	No cover image available Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices [microform] / by Mohd Salleh Ismail by Mohd. Salleh Ismail Publication details: Davis, Calif. Perpustakaan Tun Seri Lanang, 2006 Dissertation note: Thesis (Doctor of Philosophy) - University of California, 1993 Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: mikrofilem tesis TK7871.85.M84 2006. Place hold

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