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	1.	Multichip module design, fabrication and testing James J. Licari. by Licari, James J., 1930- Series: Electronic packaging and interconnection series Publication details: New York McGraw-Hill 1995 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.L53. Place hold
	2.	Adhesives technology for electronic applications : materials, processing, reliability / James J. Licari and Dale W. Swanson. by Licari, James J, 1930- Swanson, Dale W Series: Materials and processes for electronic applications series Edition: 2nd ed. Publication details: Waltham, MA : William Andrew Pub., 2011 Online resources: Table of contents only Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7871.L534 2011 3. Place hold

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