Silicon wafer bonding technology for VLSI and MEMS applications / edited by Subramanian S. Iyer and Andre J. Auberton-Herve

Contributor(s):

Series: EMIS processing series ; no. 11Publication details: London : INSPEC, 2002Description: xxv, 149 p. : ill. 26 cmISBN:

Subject(s):

Tags from this library: No tags from this library for this title. Log in to add tags.

Average rating: 0.0 (0 votes)

Holdings
Item type	Current library	Home library	Collection	Call number	Materials specified	Copy number	Status	Date due	Barcode
AM	PERPUSTAKAAN LINGKUNGAN KEDUA	PERPUSTAKAAN LINGKUNGAN KEDUA KOLEKSI AM-P. LINGKUNGAN KEDUA	-	TK7871.85.S54 (Browse shelf(Opens below))		1	Available		00001306810

There are no comments on this title.

to post a comment.