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	1.	Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harmon. by Harman, George G Harman, George G. Reliability and yield problems of wire bonding in microelectronics Series: Electronic packaging and interconnection series Edition: 2nd ed. Publication details: New York : McGraw-Hill, 1997 Online resources: Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7836.H373 1997. Place hold
	2.	Wire bonding in microelectronics / George G. Harmon by Harman, George G Harman, George G. Reliability and yield problems of wire bonding in microelectronics Edition: 3rd ed. Publication details: New York : McGraw-Hill, 2010 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (2)Call number: TK7836.H373 2010 3, ... Place hold

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