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Bonding in Microsystem Technology [electronic resource] / by Jan A. Dziuban.

By: Contributor(s): Series: Springer Series in Advanced Microelectronics ; 24Publication details: Dordrecht : Springer, 2006.Description: xviii, 331 p. : ill., digital ; 25 cmISBN:
  • 9781402045899 (electronic bk.)
Subject(s): DDC classification:
  • 620.5 22
LOC classification:
  • TK7874 .D95 2006
Online resources: In: Springer e-books
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