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	1.	Materials for electronic packaging edited by Deborah D. L. Chung by Chung, Deborah D. L Publication details: Boston : Butterworth-Heinemann, 1995 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.M38 3. Place hold
	2.	Applied materials science : applications of engineering materials in structural, electronics, thermal, and other industries / Deborah D.L. Chung. by Chung, Deborah D. L Publication details: Boca Raton, Fla. : CRC Press, 2001 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TA403.C47 2001 3. Place hold
	3.	Composite materials : functional materials for modern technologies / Deborah D.L. Chung. by Chung, Deborah D. L Series: Engineering materials and processes Publication details: London ; New York : Springer, 2003 Availability: No items available.
	4.	Applied materials science [electronic resource] : applications of engineering materials in structural, electronics, thermal, and other industries / Deborah D.L. Chung by Chung, Deborah D. L Publication details: Boca Raton, Fla. : CRC Press, c2001 Online resources: Click here to access online CRCnetBASE Click here for the electronic version Availability: No items available.

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