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	1.	No cover image available Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor / Muhammad Najib bin Harif by Muhammad Najib Harif Publication details: 2008 Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2008 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TS610.M836 2008 tesis 3. Place hold
	2.	No cover image available Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor /h [microform]/ Muhammad Najib bin Harif by Muhammad Najib Harif Publication details: Bangi, Perpustakaan Tun Seri Lanang, 2008 Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2008 Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: mikrofis tesis TS610.M836 2010. Place hold
	3.	No cover image available An investigation of clean and no-clean flux in enhancing the reliability of flip chip plastic ball grid array (PBGA) package / Ang Ye Cheah. by Ang, Ye Cheah Publication details: 2009 Dissertation note: Thesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2009. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK870.16.A546 2009 3tesis. Place hold
	4.	No cover image available Penyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) / Zainudin bin Kornain. by Zainudin Kornain Publication details: 2012 Dissertation note: Tesis (Ph.D.) - Universiti Kebangsaan Malaysia, 2012. Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TK7870.16.Z337 2012 [00008051985]. Place hold
	5.	No cover image available Isu-isu terma dalam proses aliran semula dan pematerian gelombang / Fakhrozi bin Che Ani. by Fakhrozi Che Ani [author.] Producer: 2016 Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2016. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TS610.F335 2016 3 tesis. Place hold
	6.	No cover image available Lead-free solder joint improvement in ball grid array semiconductor packages / Eu Poh Leng. by Eu, Poh Leng [author.] Producer: 2015 Dissertation note: Thesis (Ph.D) - Universiti Kebangsaan Malaysia, 2015. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.16.E945 2015 3 tesis. Place hold
	7.	No cover image available Kesan pelindung haba terhadap kewujudan retak semasa kerja semula sambungan pateri tatasusunan grid bebola berkepadatan tinggi / Adlil Aizat Ismail. by Adlil Aizat Ismail [author.] Producer: ©2023 Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2023. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15 . A335 2023 3. Place hold

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