Results of search for 'ccl=su:"Electronic packaging"'

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	1.	The Basics of soldering / Armin Rahn by Rahn, Armin Publication details: New York : John Wiley & Sons, 1993 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.R34 3. Place hold
	2.	Characterization of integrated circuit packaging materials / editors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick by Moore, Thomas M McKenna, Robert G Series: Materials characterization series Publication details: Boston : Butterworth-Heinemann, 1993 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.C52. Place hold
	3.	Electronic equipment packaging technology Gerald L. Ginsberg by Ginsberg, Gerald Publication details: New York Van Nostrand Reinhold 1992 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.G56. Place hold
	4.	Handbook of electronic package design / edited by Michael Pecht by Pecht, Michael Publication details: New York : Marcel Dekker, 1991 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.H36. Place hold
	5.	No cover image available Handbook of electronic packaging / Charles A. Harper, editor by Harper, Charles A Publication details: New York : McGraw-Hill Book, 1969 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.H28 3. Place hold
	6.	Materials for electronic packaging edited by Deborah D. L. Chung by Chung, Deborah D. L Publication details: Boston : Butterworth-Heinemann, 1995 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.M38 3. Place hold
	7.	Multichip module design, fabrication and testing James J. Licari. by Licari, James J., 1930- Series: Electronic packaging and interconnection series Publication details: New York McGraw-Hill 1995 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.L53. Place hold
	8.	Plastics for electronics : materials, properties, and design applications / William M. Alvino. by Alvino, William M [author.] Series: Electronic packaging and interconnection series Publication details: New York : McGraw-Hill, 1995 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7871.15.P5A48. Place hold
	9.	Thermal stress and strain in microelectronics packaging edited by John H. Lau by Lau, John H Publication details: New York Van Nostrand Reinhold 1993 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.T48. Place hold
	10.	Thermal management handbook : for electronic assemblies / Jerry Sergent, Al Krum. by Sergent, Jerry E Krum, Al Series: Electronic packaging and interconnection series Publication details: New York : McGraw-Hill, 1998 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.25.S47. Place hold
	11.	Polymeric materials for electronics packaging and interconnection / John H. Lupinski, editor, Robert S. Moore, editor by Lupinski, John H, 1927- Moore, Robert S, 1933- American Chemical Society. Division of Polymeric Materials: Science and Engineering American Chemical Society. Division of Polymer Chemistry American Chemical Society (196th : 1988 : Los Angeles, Calif.) Series: ACS symposium series ; 407 Publication details: Washington, DC : American Chemical Society, 1989 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.P648. Place hold
	12.	Electronic packaging materials and their properties / Michael G. Pecht ... [et al.] by Pecht, Michael G Series: The electronic packaging series Publication details: Boca Raton : CRC Press, 1999 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.E433 3. Place hold
	13.	Fundamentals of microsystems packaging / Rao R. Tummala, editor by Tummala, Rao R, 1942- Publication details: New York : McGraw-Hill, 2001 Online resources: Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.F863 3. Place hold
	14.	Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harmon. by Harman, George G Harman, George G. Reliability and yield problems of wire bonding in microelectronics Series: Electronic packaging and interconnection series Edition: 2nd ed. Publication details: New York : McGraw-Hill, 1997 Online resources: Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7836.H373 1997. Place hold
	15.	Thermal design of electronic equipment / Ralph Remsburg by Remsburg, Ralph Series: Electronics handbook series Publication details: Boca Raton, Fla. : CRC Press, 2001 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.25.R454 3. Place hold
	16.	No cover image available Electronics packaging forum / edited by James E. Morris by Morris, James E Publication details: New York : Van Nostrand Reinhold, 1991 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.E43 3. Place hold
	17.	Force sensors for microelectronic packaging applications / J. Schwizer, M. Mayer, O. Brand. by Schwizer, Juerg Mayer, M. (Michael Andreas), 1971- Brand, Oliver, 1964- Series: Microtechnology and mems Publication details: Berlin : Springer-Verlag, 2004 Online resources: Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.S34 3. Place hold
	18.	Advanced electronic packaging / edited by Richard K. Ulrich, William D. Brown by Ulrich, Richard K Brown, William D, 1943- Series: IEEE Press series on microelectronic systems Edition: 2nd ed. Publication details: Piscataway, N.J. : IEEE Press, 2006 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.A389 2006 3. Place hold
	19.	Ceramic interconnect technology handbook / edited by Fred D. Barlow III, Aicha Elshabini by Barlow, Fred D Elshabini, Aicha Publication details: Boca Raton : CRC Press/Taylor & Francis, 2007 Online resources: Table of contents only Publisher description Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7871.15.C4C465. Place hold
	20.	Force Sensors for Microelectronic Packaging Applications [electronic resource] / by Jurg Schwizer, Michael Mayer, Oliver Brand. by Schwizer, Jurg Mayer, Michael Brand, Oliver SpringerLink (Online service) Series: Microtechnology and MEMS Publication details: Berlin, Heidelberg : Springer-Verlag Berlin Heidelberg, 2005 In: Springer e-books Online resources: Click here to access online Availability: No items available.

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