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	21.	Mems and microsystems : design, manufacture, and packaging / Tai-Ran Hsu by Hsu, Tai-Ran Edition: 2nd ed. Publication details: Hoboken, N. J. : John Wiley & Sons, 2008 Online resources: Table of contents only Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.H784 2008 3. Place hold
	22.	Microelectronic packaging [electronic resource] / edited by M. Datta, T. Osaka, J. W. Schultze by Datta, Madhav saka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter) Series: New trends in electrochemical technology ; v. 3 Publication details: Boca Raton, FL : CRC Press, c2005 Online resources: Click here to access online CRCnetBASE Click here for the electronic version Availability: No items available.
	23.	Introduction to system-on-package (SOP) : miniaturization of the entire system / Rao R. Tummala, Madhavan Swaminathan by Tummala, Rao R, 1942- Swaminathan, Madhavan Publication details: New York : McGraw-Hill, 2008 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.T864 3. Place hold
	24.	RF and microwave microelectronics packaging / Ken Kuang, Franklin Kim, Sean S. Cahill, editors by Kuang, Ken Kim, Franklin Cahill, Sean S Publication details: Heidelberg : Springer, 2009 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.R453. Place hold
	25.	RF and Microwave Microelectronics Packaging [electronic resource] / edited by Ken Kuang, Franklin Kim, Sean S. Cahill. by Kuang, Ken Cahill, Sean S Kim, Franklin SpringerLink (Online service) Publication details: Boston, MA : Springer Science+Business Media, LLC, 2010 In: Springer eBooks Online resources: Click here to access online Availability: No items available.
	26.	Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / Sheng Liu, Yong Liu. by Liu, S. (Sheng), 1963- Liu, Yong, 1962- Publication details: [Beijing] : Chemical Industry Press, 2011 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.L568 3. Place hold
	27.	No cover image available Kesan penggunaan substrak berbeza dalam pakej cip tanpa kaki / Mohamad Faizal bin Abdullah. by Mohamad Faizal Abdullah [author.] Producer: 2009 Dissertation note: Tesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2009. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.M843 2009 3 tesis. Place hold
	28.	MEMS : fundamental technology and applications / edited by Vikas Choudhary, Krzysztof Iniewski. by Choudhary, Vikas [editor.] Iniewski, Krzysztof [editor.] Series: Devices, circuits, and systems \| Devices, circuits, and systemsPublisher: Boca Raton : CRC Press,Taylor & Francis Group, [2013]Copyright date: ©2013 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7875.M457 3. Place hold
	29.	No cover image available Pencirian antarasambungan pakej mikroelektronik terhadap keadaan sinar gamma terlampau / Wan Yusmawati binti Wan Yusoff. by Wan Yusmawati Wan Yusoff [author.] Producer: 2014 Dissertation note: Tesis (Ph.D.) - Universiti Kebangsaan Malaysia, 2014. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.W343 2014 3 tesis. Place hold
	30.	No cover image available Pengoptimuman rekabentuk pakej Quad Flat No-Lead (QFN) Die Bertindan / Nur Nadia binti Bachok. by Nur Nadia Bachok [author.] Producer: 2009 Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2009. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.N845 2009 3 tesis. Place hold

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