Results of search for 'ccl=su:"Electronic packaging"'

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	21.	Hot Cracking Phenomena in Welds [electronic resource] / edited by Thomas Bollinghaus, Horst Herold. by Bollinghaus, Thomas Herold, Horst SpringerLink (Online service) Publication details: Berlin, Heidelberg : Springer-Verlag Berlin Heidelberg, 2005 In: Springer e-books Online resources: Click here to access online Availability: No items available.
	22.	Practical guide to the packaging of electronics [electronic resource] : thermal and mechanical design and analysis / Ali Jamnia by Jamnia, Ali, 1961- Edition: 2nd ed. Publication details: Boca Raton : CRC Press, 2009 Online resources: Click here to access online CRCnetBASE Click here for the electronic version Availability: No items available.
	23.	Practical guide to the packaging of electronics [electronic resource] : thermal and mechanical design and analysis / Ali Jamnia by Jamnia, Ali, 1961- Series: Mechanical engineering (Marcel Dekker, Inc.) ; 146 Publication details: New York : Marcel Dekker, c2003 Online resources: Click here to access online CRCnetBASE Click here for the electronic version Availability: No items available.
	24.	The electronic packaging handbook [electronic resource] / edited by Glenn R. Blackwell by Blackwell, Glenn R Series: Electronics handbook series Publication details: Boca Raton, FL : CRC Press : IEEE Press, c2000 Online resources: Click here to access online CRCnetBASE Click here for the electronic version Availability: No items available.
	25.	Run-to-run control in semiconductor manufacturing [electronic resource] / edited by James Moyne, Enrique del Castillo, Arnon Max Hurwitz by Moyne, James Del Castillo, Enrique Hurwitz, Arnon Max Publication details: Boca Raton : CRC Press, 2001 Online resources: Click here to access online CRCnetBASE Click here for the electronic version Availability: No items available.
	26.	Thermal design of electronic equipment [electronic resource] / Ralph Remsburg by Remsburg, Ralph Series: Electronics handbook series Publication details: Boca Raton, Fla. : CRC Press, c2001 Online resources: Click here to access online CRCnetBASE Click here for the electronic version Availability: No items available.
	27.	Wire bonding in microelectronics / George G. Harmon by Harman, George G Harman, George G. Reliability and yield problems of wire bonding in microelectronics Edition: 3rd ed. Publication details: New York : McGraw-Hill, 2010 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (2)Call number: TK7836.H373 2010 3, ... Place hold
	28.	Heat transfer : thermal management of electronics / Younes Shabany by Shabany, Younes Publication details: Boca Raton, FL. : CRC Press, 2010 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.25.S534 3. Place hold
	29.	No cover image available Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN / Mohamad Firdaus bin Rosle by Mohamad Firdaus Rosle Publication details: 2010 Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2010 Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TK7874.M844 2010 tesis (00008052076). Place hold
	30.	No cover image available Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN [microform] / Mohamad Firdaus bin Rosle by Mohamad Firdaus Rosle Publication details: Universiti Kebangsaan Malaysia, Bangi : 2012 Dissertation note: Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2010 Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: mikrofilem tesis TK7874 .M844 2012. Place hold
	31.	Adhesives technology for electronic applications : materials, processing, reliability / James J. Licari and Dale W. Swanson. by Licari, James J, 1930- Swanson, Dale W Series: Materials and processes for electronic applications series Edition: 2nd ed. Publication details: Waltham, MA : William Andrew Pub., 2011 Online resources: Table of contents only Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7871.L534 2011 3. Place hold
	32.	Hermeticity of electronic packages / Hal Greenhouse, Robert Lowry, Bruce Romenesko. by Greenhouse, Hal Lowry, Robert (Robert K.), 1944- Romenesko, Bruce Edition: 2nd ed. Publication details: Oxford : Elsevier, William Andrew, 2012 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.G744 2012 3. Place hold
	33.	LED packaging for lighting applications : design, manufacturing and testing / Sheng Liu, Xiaobing Luo. by Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974- Publication details: Singapore : John Wiley & Sons (Asia), 2011 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7871.89.L53L568 3. Place hold
	34.	No cover image available Pencirian morfologi permukaan kapilari bagi hasil keluaran lekatan wayar pakej ultra fine pitch large quad flat / Nurul Hidayah Mohamad Nor. by Nurul Hidayah Mohamad Nor Publication details: 2011 Dissertation note: Thesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2011. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.N847 2011 3tesis. Place hold
	35.	No cover image available Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) / Saidatul Azura binti Radzi. by Saidatul Azura Radzi Publication details: 2011 Dissertation note: Tesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2011. Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TK7836.S235 2011 [00008051987]. Place hold
	36.	No cover image available Penyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) / Zainudin bin Kornain. by Zainudin Kornain Publication details: 2012 Dissertation note: Tesis (Ph.D.) - Universiti Kebangsaan Malaysia, 2012. Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TK7870.16.Z337 2012 [00008051985]. Place hold
	37.	No cover image available Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) [microform] / Saidatul Azura binti Radzi. by Saidatul Azura Radzi Publication details: Bangi: Perpustakaan Tun Seri Lanang, 2013 Dissertation note: Tesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2011. Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: Mikrofis tesis TK7836 \b .S235 2013. Place hold
	38.	No cover image available Pencirian kebolehtahanan pakej semikonduktor dai bertingkat tanpa kaki / Mohd Faridz bin Mod Yunoh @ Mohd Yunus. by Mohd Faridz bin Mod Yunoh @ Mohd Yunus [author.] Producer: 2011 Dissertation note: Tesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2011. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.M844 2011 3 tesis. Place hold
	39.	No cover image available An investigation on mechanical properties of tin-silver copper and tin-silver lead-free solder sphere used in FCPBGA electronic packages / Wong Tzu Ling. by Wong, Tszu Ling [author.] Producer: 2012 Dissertation note: Thesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2012. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.16.W643 2012 3 tesis. Place hold
	40.	No cover image available Pencirian sambungan pelekatan wayar dengan menggunakan kaedah pelekukan nano / Muhammad Nubli bin Zulkifli. by Muhammad Nubli Zulkifli [author.] Producer: 2014 Dissertation note: Tesis (P.hD.) - Universiti Kebangsaan Malaysia, 2014. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7836.M846 2014 3 tesis. Place hold

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