Results of search for 'ccl=su:"Electronic packaging."'

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	1.	Adhesives technology for electronic applications : materials, processing, reliability / James J. Licari and Dale W. Swanson. by Licari, James J, 1930- Swanson, Dale W Series: Materials and processes for electronic applications series Edition: 2nd ed. Publication details: Waltham, MA : William Andrew Pub., 2011 Online resources: Table of contents only Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7871.L534 2011 3. Place hold
	2.	Advanced electronic packaging / edited by Richard K. Ulrich, William D. Brown by Ulrich, Richard K Brown, William D, 1943- Series: IEEE Press series on microelectronic systems Edition: 2nd ed. Publication details: Piscataway, N.J. : IEEE Press, 2006 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.A389 2006 3. Place hold
	3.	The Basics of soldering / Armin Rahn by Rahn, Armin Publication details: New York : John Wiley & Sons, 1993 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.R34 3. Place hold
	4.	Ceramic interconnect technology handbook / edited by Fred D. Barlow III, Aicha Elshabini by Barlow, Fred D Elshabini, Aicha Publication details: Boca Raton : CRC Press/Taylor & Francis, 2007 Online resources: Table of contents only Publisher description Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7871.15.C4C465. Place hold
	5.	Characterization of integrated circuit packaging materials / editors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick by Moore, Thomas M McKenna, Robert G Series: Materials characterization series Publication details: Boston : Butterworth-Heinemann, 1993 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.C52. Place hold
	6.	Electronic equipment packaging technology Gerald L. Ginsberg by Ginsberg, Gerald Publication details: New York Van Nostrand Reinhold 1992 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.G56. Place hold
	7.	The electronic packaging handbook [electronic resource] / edited by Glenn R. Blackwell by Blackwell, Glenn R Series: Electronics handbook series Publication details: Boca Raton, FL : CRC Press : IEEE Press, c2000 Online resources: Click here to access online CRCnetBASE Click here for the electronic version Availability: No items available.
	8.	Electronic packaging materials and their properties / Michael G. Pecht ... [et al.] by Pecht, Michael G Series: The electronic packaging series Publication details: Boca Raton : CRC Press, 1999 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.E433 3. Place hold
	9.	No cover image available Electronics packaging forum / edited by James E. Morris by Morris, James E Publication details: New York : Van Nostrand Reinhold, 1991 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.E43 3. Place hold
	10.	Force sensors for microelectronic packaging applications / J. Schwizer, M. Mayer, O. Brand. by Schwizer, Juerg Mayer, M. (Michael Andreas), 1971- Brand, Oliver, 1964- Series: Microtechnology and mems Publication details: Berlin : Springer-Verlag, 2004 Online resources: Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7874.S34 3. Place hold
	11.	Force Sensors for Microelectronic Packaging Applications [electronic resource] / by Jurg Schwizer, Michael Mayer, Oliver Brand. by Schwizer, Jurg Mayer, Michael Brand, Oliver SpringerLink (Online service) Series: Microtechnology and MEMS Publication details: Berlin, Heidelberg : Springer-Verlag Berlin Heidelberg, 2005 In: Springer e-books Online resources: Click here to access online Availability: No items available.
	12.	Fundamentals of microsystems packaging / Rao R. Tummala, editor by Tummala, Rao R, 1942- Publication details: New York : McGraw-Hill, 2001 Online resources: Table of contents Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.F863 3. Place hold
	13.	Handbook of electronic package design / edited by Michael Pecht by Pecht, Michael Publication details: New York : Marcel Dekker, 1991 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.H36. Place hold
	14.	No cover image available Handbook of electronic packaging / Charles A. Harper, editor by Harper, Charles A Publication details: New York : McGraw-Hill Book, 1969 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.H28 3. Place hold
	15.	Heat transfer : thermal management of electronics / Younes Shabany by Shabany, Younes Publication details: Boca Raton, FL. : CRC Press, 2010 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.25.S534 3. Place hold
	16.	Hermeticity of electronic packages / Hal Greenhouse, Robert Lowry, Bruce Romenesko. by Greenhouse, Hal Lowry, Robert (Robert K.), 1944- Romenesko, Bruce Edition: 2nd ed. Publication details: Oxford : Elsevier, William Andrew, 2012 Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.15.G744 2012 3. Place hold
	17.	Hot Cracking Phenomena in Welds [electronic resource] / edited by Thomas Bollinghaus, Horst Herold. by Bollinghaus, Thomas Herold, Horst SpringerLink (Online service) Publication details: Berlin, Heidelberg : Springer-Verlag Berlin Heidelberg, 2005 In: Springer e-books Online resources: Click here to access online Availability: No items available.
	18.	No cover image available An investigation on mechanical properties of tin-silver copper and tin-silver lead-free solder sphere used in FCPBGA electronic packages / Wong Tzu Ling. by Wong, Tszu Ling [author.] Producer: 2012 Dissertation note: Thesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2012. Availability: Items available for loan: PERPUSTAKAAN LINGKUNGAN KEDUA (1)Call number: TK7870.16.W643 2012 3 tesis. Place hold
	19.	No cover image available Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) / Saidatul Azura binti Radzi. by Saidatul Azura Radzi Publication details: 2011 Dissertation note: Tesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2011. Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: TK7836.S235 2011 [00008051987]. Place hold
	20.	No cover image available Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) [microform] / Saidatul Azura binti Radzi. by Saidatul Azura Radzi Publication details: Bangi: Perpustakaan Tun Seri Lanang, 2013 Dissertation note: Tesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2011. Availability: Items available for loan: PERPUSTAKAAN TUN SERI LANANG (1)Call number: Mikrofis tesis TK7836 \b .S235 2013. Place hold

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