TY  - BOOK
AU  - Tu,King-Ning
ED  - SpringerLink (Online service)
TI  - Solder Joint Technology: Materials, Properties, and Reliability 
SN  - 9780387388922 (electronic bk.)
U1  - 621.381 22
PY  - 2007///
CY  - New York
PB  - Springer
KW  - Chemistry
KW  - Electronics and Microelectronics, Instrumentation
KW  - Manufacturing, Machines, Tools
KW  - Metallic Materials
KW  - Optical and Electronic Materials
KW  - Quality Control, Reliability, Safety and Risk
UR  - https://eresourcesptsl.ukm.remotexs.co/user/login?url=http://dx.doi.org/10.1007/978-0-387-38892-2
ER  -