Lai, Chin Yung, <br/><br/>
Fabrication of a new printing ink with Bimetal system containing tin and silver for leadframe integrated circuit packaging 
Lai Chin Yung. 
 - xxiii, 183 pages :  illustrations ;  30 cm. 
<br/><br/> Tesis sedang dalam proses di Unit Katalog, PTSL dan telah dihantar pada 7.7.2017. 
<br/><br/>Thesis (Ph.D.) - Universiti Kebangsaan Malaysia, 2016. 
<br/><br/>References : page 169-182. 
<br/><br/><label>Subjects--Corporate Names: </label><br/>Universiti Kebangsaan Malaysia--Dissertations.
<br/><br/><label>Subjects--Topical Terms: </label><br/>ink-jet printing.<br/>Tin.<br/>Printing ink.<br/>Silver.<br/>Dissertations, Academic--Malaysia.