TY  - BOOK
AU  - Eu,Poh Leng
TI  - Lead-free solder joint improvement in ball grid array semiconductor packages
PY  - 2015///
KW  - Universiti Kebangsaan Malaysia
KW  - Dissertations
KW  - Solder and soldering
KW  - Lead-free electronics manufacturing processes
KW  - Dissertations, Academic
KW  - Malaysia
KW  - Ball grid array technology
N1  - Thesis (Ph.D) - Universiti Kebangsaan Malaysia, 2015; References : pages 191-201
ER  -