TY  - BOOK
AU  - Wong,Tszu Ling
TI  - An investigation on mechanical properties of tin-silver copper and tin-silver lead-free solder sphere used in FCPBGA electronic packages
PY  - 2012///
KW  - Universiti Kebangsaan Malaysia
KW  - Dissertations
KW  - Dissertations, Academic
KW  - Malaysia
KW  - Flip chip technology
KW  - Copper
KW  - Electronic packaging
N1  - Thesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2012; References : pages [76]-79
ER  -