TY  - BOOK
AU  - Doi,Toshiro K.
AU  - Marinescu,Ioan D.
AU  - Kurokawa,Syuhei
TI  - Advances in CMP/polishing technologies for the manufacture of electronic devices
SN  - 9781437778595
PY  - 2012///
CY  - Oxford
PB  - Elsevier
KW  - Grinding and polishing
KW  - Chemical mechanical planarization
KW  - Electrolytic polishing
N1  - Includes bibliographical references and index
N2  - CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components.  --P. 4 of cover
ER  -