Advances in CMP/polishing technologies for the manufacture of electronic devices / 
 CMP polishing technologies for the manufacture of electronic devices 
edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa. 
 - Oxford :  Elsevier,  c2012. 
 - xii, 317 p. :  ill. ;  24 cm. 
<br/><br/>Includes bibliographical references and index. 
<br/><br/> CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components.  --P. 4 of cover. 
<br/><br/><label>ISBN: </label>9781437778595 1437778593 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Grinding and polishing.<br/>Chemical mechanical planarization.<br/>Electrolytic polishing.