TY  - BOOK
AU  - Licari,James J.
AU  - Swanson,Dale W.
TI  - Adhesives technology for electronic applications: materials, processing, reliability 
T2  - Materials and processes for electronic applications series
SN  - 9781437778892
PY  - 2011///
CY  - Waltham, MA
PB  - William Andrew Pub.
KW  - Electronics
KW  - Materials
KW  - Adhesives
KW  - Electronic packaging
N1  - Includes bibliographical references and index
UR  - http://www.loc.gov/catdir/toc/fy12pdf01/2011292645.html
ER  -