TY  - BOOK
AU  - Perkins,Andrew E.
AU  - Sitaraman,Suresh K.
ED  - SpringerLink (Online service)
TI  - Solder joint reliability prediction for multiple environments
SN  - 9780387793948
PY  - 2009///
CY  - Boston, MA
PB  - Springer Science+Business Media, LLC
KW  - Electronic apparatus and appliances
KW  - Reliability
KW  - Joints (Engineering)
KW  - Solder and soldering
KW  - Electronics and Microelectronics, Instrumentation
KW  - Metallic Materials
KW  - Optical and Electronic Materials
KW  - Quality Control, Reliability, Safety and Risk
UR  - https://eresourcesptsl.ukm.remotexs.co/login?url=http://dx.doi.org/10.1007/978-0-387-79394-8
ER  -