TY  - BOOK
AU  - Harman,George G.
AU  - Harman,George G.
TI  - Wire bonding in microelectronics
SN  - 9780071476232 :
PY  - 2010///
CY  - New York
PB  - McGraw-Hill
KW  - Wire bonding (Electronic packaging)
KW  - Production control
KW  - Electronic packaging
KW  - Reliability
KW  - Defects
KW  - Semiconductors
KW  - Failures
N1  - Rev. ed. of : Reliability and yield problems of wire bonding in microelectronics, 1989; Book is accompanied by 1 computer optical disc, entitled'Wire bonding in microelectronics, 3rd ed.' bearing the same call number and available at Bahagian Koleksi Media
ER  -