Wire bonding in microelectronics - Harman, George G.; Harman, George G. (New York : McGraw-Hill, 2010)
Rev. ed. of : Reliability and yield problems of wire bonding in microelectronics, 1989
Book is accompanied by 1 computer optical disc, entitled'Wire bonding in microelectronics, 3rd ed.' bearing the same call number and available at Bahagian Koleksi Media
Keywords: Wire bonding (Electronic packaging) -- Production control; Electronic packaging -- Reliability; Electronic packaging -- Defects; Semiconductors -- Failures