Harman, George G. <br/><br/>
Wire bonding in microelectronics / 
George G. Harmon 
 - 3rd ed. 
 - New York :  McGraw-Hill,  2010 
 - xx, 426 p. :  ill. ;  24 cm. +  1 computer optical disc (4 3/4 in.) 
<br/><br/> Rev. ed. of : Reliability and yield problems of wire bonding in microelectronics, 1989  Book is accompanied by 1 computer optical disc, entitled'Wire bonding in microelectronics, 3rd ed.' bearing the same call number and available at Bahagian Koleksi Media 
<br/><br/><label>ISBN: </label>9780071476232 :  RM260.68 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Wire bonding (Electronic packaging)--Production control<br/>Electronic packaging--Reliability<br/>Electronic packaging--Defects<br/>Semiconductors--Failures