TY  - BOOK
AU  - Tan,Chuan Seng
AU  - Reif,L.Rafael
AU  - Gutmann,Ronald J.
ED  - SpringerLink (Online service)
TI  - Wafer level 3-d ics process technology
SN  - 9780387765341 (electronic bk.)
AV  - TK7874 .W34 2008
U1  - 621.3815 22
PY  - 2008///
CY  - Boston, MA
PB  - Springer-Verlag US
KW  - Integrated circuits
KW  - Wafer-scale integration
KW  - Engineering
KW  - Surfaces and Interfaces, Thin Films
KW  - Optical and Electronic Materials
KW  - Electronics and Microelectronics, Instrumentation
KW  - Engineering, general
UR  - https://eresourcesptsl.ukm.remotexs.co/user/login?url=http://dx.doi.org/10.1007/978-0-387-76534-1
ER  -