Wafer level 3-d ics process technology  [electronic resource] / 
edited by Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif. 
 - Boston, MA :  Springer-Verlag US,  2008. 
 - xiv, 358 p. :  ill., digital ;  24 cm. 
 - Series on integrated circuits and systems,  1558-9412 .
<br/><br/><label>ISBN: </label>9780387765341 (electronic bk.) 9780387765327 (paper) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Integrated circuits--Wafer-scale integration.<br/>Engineering.<br/>Surfaces and Interfaces, Thin Films.<br/>Optical and Electronic Materials.<br/>Electronics and Microelectronics, Instrumentation.<br/>Engineering, general.
<br/><br/><label>LC Class. No.: </label>TK7874  / .W34 2008 
<br/><br/><label>Dewey Class. No.: </label>621.3815