TY  - BOOK
AU  - Dziuban,Jan A.
ED  - SpringerLink (Online service)
TI  - Bonding in Microsystem Technology
T2  - Springer Series in Advanced Microelectronics,
SN  - 9781402045899 (electronic bk.)
AV  - TK7874 .D95 2006
U1  - 620.5 22
PY  - 2006///
CY  - Dordrecht
PB  - Springer
KW  - Microtechnology
KW  - Micromachining
KW  - Engineering
KW  - Optical and Electronic Materials
KW  - Electronics and Microelectronics, Instrumentation
KW  - Physics and Applied Physics in Engineering
KW  - Continuum Mechanics and Mechanics of Materials
KW  - Operating Procedures, Materials Treatment
UR  - https://eresourcesptsl.ukm.remotexs.co/user/login?url=http://dx.doi.org/10.1007/1-4020-4589-1
ER  -