Dziuban, Jan A. <br/><br/>
Bonding in Microsystem Technology  [electronic resource] / 
by Jan A. Dziuban. 
 - Dordrecht :  Springer,  2006. 
 - xviii, 331 p. :  ill., digital ;  25 cm. 
 - Springer Series in Advanced Microelectronics,  24  1437-0387 ; .
<br/><br/><label>ISBN: </label>9781402045899 (electronic bk.) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microtechnology.<br/>Micromachining.<br/>Engineering.<br/>Optical and Electronic Materials.<br/>Electronics and Microelectronics, Instrumentation.<br/>Physics and Applied Physics in Engineering.<br/>Continuum Mechanics and Mechanics of Materials.<br/>Operating Procedures, Materials Treatment.
<br/><br/><label>LC Class. No.: </label>TK7874  / .D95 2006 
<br/><br/><label>Dewey Class. No.: </label>620.5