TY  - BOOK
AU  - Zschech,Ehrenfried
AU  - Whelan,Caroline
AU  - Mikolajick,Thomas
ED  - Euromat 2003
ED  - SpringerLink (Online service)
TI  - Materials for Information Technology: Devices, Interconnects and Packaging 
SN  - 9781846282355 (electronic bk.)
AV  - TK7874 .E75 2003
U1  - 621.381 22
PY  - 2005///
CY  - London
PB  - Springer-Verlag London Limited
KW  - Microelectronics
KW  - Materials
KW  - Congresses
KW  - Information technology
KW  - Engineering
KW  - Metallic Materials
KW  - Ceramics, Glass, Composites, Natural Methods
KW  - Surfaces and Interfaces, Thin Films
KW  - Electronics and Microelectronics, Instrumentation
KW  - Physics and Applied Physics in Engineering
KW  - Solid State Physics and Spectroscopy
UR  - https://eresourcesptsl.ukm.remotexs.co/login?url=http://dx.doi.org/10.1007/1-84628-235-7
ER  -