Materials for Information Technology  Devices, Interconnects and Packaging /  [electronic resource] : 
edited by Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick. 
 - London :  Springer-Verlag London Limited,  2005. 
 - xix, 508 p. :  ill., digital ;  24 cm. 
 - Engineering Materials and Processes,  1619-0181 .
<br/><br/><label>ISBN: </label>9781846282355 (electronic bk.) 9781852339418 (paper) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronics--Materials--Congresses.<br/>Information technology--Congresses.<br/>Engineering.<br/>Metallic Materials.<br/>Ceramics, Glass, Composites, Natural Methods.<br/>Surfaces and Interfaces, Thin Films.<br/>Electronics and Microelectronics, Instrumentation.<br/>Physics and Applied Physics in Engineering.<br/>Solid State Physics and Spectroscopy.
<br/><br/><label>LC Class. No.: </label>TK7874  / .E75 2003 
<br/><br/><label>Dewey Class. No.: </label>621.381